Brett T. Holaway - Cosmos MN Mark A. Miller - Hutchinson MN Eric O. Naatz - Hutchinson MN John A. Rickeman - Hutchinson MN Richard A. Schnitzler - Dassel MN Raymond R. Wolter - Hutchinson MN David J. Zachmeyer - Hutchinson MN
Assignee:
Hutchinson Technology, Inc. - Hutchinson MN
International Classification:
G11B 542
US Classification:
2960303, 269 48
Abstract:
A head suspension for supporting a head slider over a rigid disk in a dynamic storage device having a component that includes a compliant feature adapted to engage a first pin and a datum engaging surface spaced from the compliant feature. The component being locatable relative to a datum by manipulation of the component with respect to the datum and a first pin to cause the first pin to engage and deflect the compliant feature when the datum engaging surface of the component is engaged and positioned with respect to the datum. The head suspension also including a second component having a pin engaging feature and possibly a datum engaging surface alignable with the compliant feature and datum engaging surface of the first component, respectively. The pin engaging feature of the second component being compliant or non-compliant. The compliant and non-compliant features being usable for locating head suspension components, such as load beams, flexures, and base plates, relative to each other or to tooling for head suspension fabrication purposes.
Head Suspension Having Tapered Processing Holes And Method For Aligning Tooling During Suspension Manufacture
Kent M. Adams - Eau Claire WI Michael L. Gruber - Chippewa Falls WI Michael T. Haapala - Eau Claire WI Aaron J. Halberg - Hayward WI John D. Hutchison - Menomonie WI Steven G. OBrien - Fall Creek WI Raymond R. Wolter - Hutchinson MN
A head suspension for a rigid disk drive comprising one or more tapered processing holes in the load beam. The tapered processing holes can be located in the rigid region, the flexure or the mounting region. The tapered processing holes have a first diameter at a first surface of the load beam and a second diameter at a second surface of the load beam, wherein the first diameter is less than the second diameter. A method of processing a head suspension for a rigid disk drive is also disclosed. A processing tool is operatively engaging with the tapered processing hole to perform one of mechanically or optically locating, measuring. mounting, and/or aligning a suspension arm or components thereof.
Stevenson J. Marek - Hutchinson MN Craig A. Leabch - Saint Cloud MN Mark A. Miller - Hutchinson MN Anthony J. Liberko - Hutchinson MN Raymond R. Wolter - Hutchinson MN Steven R. Lagergren - Litchfield MN
A switchable shunt has an insulating layer separating conductive lead and spring metal layers. The shunt includes a base region formed on the spring metal layer, one or more arms formed in the conductive lead layer and at least one of the insulating and spring metal layers, one or more pad regions electrically coupled to an arm and formed in at least the conductive lead layer, and one or more gaps. Each arm extends through a gap and is resiliently biased toward a shunted state with the pad region in electrical contact with the base region. The shunt is movable to an electrically open state where the pad and base regions are electrically isolated. A method of making the shunt includes etching the shunt from laminated material and pushing the arm and pad through the gap. The shunt may be operated by applying a force to the arm.
A method for aligning head suspension structures minimize to misalignments between a flexure and a load beam of the head suspension. The load beam and the flexure of the head suspension include a first aperture formed near a load point dimple of the head suspension to provide a reference datum. An elongated alignment aperture is formed in the rigid region of the load beam, and a proximal alignment aperture and a distal alignment aperture are formed in the flexure. The elongated the aperture overlaps at least a portion of the proximal and distal alignment apertures in such a manner that the proximal perimeter edge of the elongated aperture encroaches on the proximal alignment aperture and the proximal perimeter edge of the distal alignment aperture encroaches upon the elongated alignment aperture. This configuration of apertures allows the flexure and load beam to be independently aligned relative to each other by pins of an alignment tool that engage the proximal perimeter edge of the distal alignment aperture and the proximal perimeter edge of the elongated alignment aperture.
Head Suspension With Compliant Feature For Component Location
Brett T. Holaway - Cosmos MN Mark A. Miller - Hutchinson MN Eric O. Naatz - Hutchinson MN John A. Rickeman - Hutchinson MN Richard A. Schnitzler - Dassel MN Raymond R. Wolter - Hutchinson MN David J. Zachmeyer - Hutchinson MN
A head suspension for supporting a head slider over a rigid disk in a dynamic storage device having a component that includes a compliant feature adapted to engage a first pin and a datum engaging surface spaced from the compliant feature. The component being locatable relative to a datum by manipulation of the component with respect to the datum and a first pin to cause the first pin to engage and deflect the compliant feature when the datum engaging surface of the component is engaged and positioned with respect to the datum. The head suspension also including a second component having a pin engaging feature and possibly a datum engaging surface alignable with the compliant feature and datum engaging surface of the first component, respectively. The pin engaging feature of the second component being compliant or non-compliant. The compliant and non-compliant features being usable for locating head suspension components, such as load beams, flexures, and base plates, relative to each other or to tooling for head suspension fabrication purposes.
Method Of Operating Switchable Shunts For Integrated Lead Suspensions
Stevenson J. Marek - Hutchinson MN Craig A. Leabch - Saint Cloud MN Mark A. Miller - Hutchinson MN Anthony J. Liberko - Hutchinson MN Raymond R. Wolter - Hutchinson MN Steven R. Lagergren - Litchfield MN
Assignee:
Hutchinson Technology Inc. - Hutchinson MN
International Classification:
G11B 540
US Classification:
200 16D, 200283
Abstract:
A switchable shunt has an insulating layer separating conductive lead and spring metal layers. The shunt includes a base region formed on the spring metal layer, one or more arms formed in the conductive lead layer and at least one of the insulating and spring metal layers, one or more pad regions electrically coupled to an arm and formed in at least the conductive lead layer, and one or more gaps. Each arm extends through a gap and is resiliently biased toward a shunted state with the pad region in electrical contact with the base region. The shunt is movable to an electrically open state where the pad and base regions are electrically isolated. A method of making the shunt includes etching the shunt from laminated material and pushing the arm and pad through the gap. The shunt may be operated by applying a force to the arm.
Head Suspension Configured For Improved Thermal Performance During Solder Ball Bonding To Head Slider
A head suspension or head suspension component article configured for solder ball bonding of a head slider to electrical traces on article. The article including electrical traces formed from electrically conductive material with the electrical traces having a bonding region adapted for electrical bonding to a head slider. Also included is a support structure providing support for at least portions of the electrical traces and including a head slider mounting region adapted to receive the head slider. This structure is configured to mechanically and thermally isolate the bonding region of the electrical traces from the head slider mounting region to reduce mechanical and thermal effects of a solder ball bonding process on the article during solder ball bonding of the head slider to the electrical traces. The support structure may be reduced at or around the bonding region, or the conductive material may be increased to dissipate more heat.
A head suspension or head suspension component for use in supporting a read/write head in a storage device, the head suspension or head suspension component including an integrated circuit chip as a structural element of the head suspension or head suspension component. The chip is included as part of a load beam or as a stiffener for a load beam. A flexure or other gimballing device is mounted to the chip or to a portion of the load beam that is mounted to the chip. The chip may be configured for improved heat dissipation or resonant characteristics. The chip is mounted to head suspension components in various ways, including the use of attachment features formed in the chip. A method of making a head suspension or head suspension component that includes mounting a chip as a structural element of the head suspension or head suspension component is also included.