Richard Ray Ross

Address:

PO Box 30732, Phoenix, AZ 85046

Phone:

(602)5747441

VIN:

5J6RE38709L006804

Make:

HONDA

Model:

CR-V

Year:

2009

US Patent:

6753129, Jun 22, 2004

Filed:

Mar 4, 2002

Appl. No.:

10/090465

Inventors:

William R. Livesay - San Diego CA
Matthew F. Ross - San Diego CA
Richard L. Ross - Del Mar CA

Assignee:

Applied Materials Inc. - Santa Clara CA

International Classification:

G03G 500

US Classification:

430296, 430311, 430328, 430329, 430942

Abstract:

A method for increasing the etch resistance of positive working chemically amplified photoresist such as 193 nanometer sensitive photoresist, 157 nanometer sensitive photoresist, and deep-UV 248 nanometer sensitive photoresist while improving and maintaining fidelity of lithographic features and critical dimensions. The method involves coating and drying a photosensitive composition onto a substrate. The photosensitive composition comprises a water insoluble, acid decomposable polymer which is substantially transparent to ultraviolet or x-ray radiation and a compound capable of generating an acid upon exposure to sufficient activating ultraviolet, electron beam or x-ray radiation energy. After imagewise exposing and developing, the image areas of the photosensitive composition are irradiated to electron beam radiation to thereby increase the resistance of the photosensitive composition in the image areas to an etchant while simultaneously cooling the photosensitive composition during electron beam radiation to maintain the photosensitive composition at a temperature of less than about 20Â C.

US Patent:

7331691, Feb 19, 2008

Filed:

Oct 29, 2004

Appl. No.:

10/977923

Inventors:

William R. Livesay - San Diego CA, US
Kari W. Beeson - Princeton NJ, US
Scott M. Zimmerman - Baskin Ridge NJ, US
Chad R. Livesay - Encinitas CA, US
Richard L. Ross - Del Mar CA, US

Assignee:

Goldeneye, Inc. - San Diego CA

International Classification:

F21V 29/00

US Classification:

362294, 362373, 362249

Abstract:

High brightness LEDs are mounted directly on a heat pipe or are mounted on a substrate, which is mounted on the heat pipe. The heat pipe can be a common electrode for the LEDs mounted on the heat pipe. Multiple heat pipes can be arranged so that the LED arrays form a light recycling cavity to emit and reflect light.

US Patent:

7753562, Jul 13, 2010

Filed:

May 21, 2008

Appl. No.:

12/154397

Inventors:

William R. Livesay - San Diego CA, US
Scott M. Zimmerman - Basking Ridge NJ, US
Richard L. Ross - Del Mar CA, US

Assignee:

Goldeneye, Inc. - San Diego CA

International Classification:

F21V 7/20

US Classification:

362310, 362580

Abstract:

A LED light source is integrated with a heatsink and a collimator. Four isolated heatsinks form an optical taper in which a single color LED is mounted. The LEDs are arranged to form a reflective light recycling cavity. Up to four different colors can be combined inside the light recycling cavity to form a uniform and homogenous mixing of the colors at the exit aperture of the light recycling cavity and/or the exit aperture of the collimator/heatsink.

US Patent:

7901524, Mar 8, 2011

Filed:

Feb 3, 2006

Appl. No.:

11/347505

Inventors:

Geoffrey McKnight - Los Angeles CA, US
Chris Henry - Newbury Park CA, US
Andrew Keefe - Encino CA, US
Richard Ross - Los Angeles CA, US
Guillermo Herrera - Winnetka CA, US

Assignee:

HRL Laboratories, LLC - Malibu CA

International Classification:

C22F 1/00
B64C 5/10
B29C 61/00
B21D 39/08

US Classification:

148563, 72 57, 72700, 244 998, 264230

Abstract:

Apparatus and associated methods for actuating variable stiffness material (VSM) structures and achieving deformation of the structures. The apparatus and the associated methods use internal embedded actuation elements and/or externally attached elements to the VSM structures to achieve the desired deformation. In particular, the actuation can be changed due to the variable stiffness nature of the materials. That is, the invention provides the ability to control the deformation of structures using local stiffness control over subregions of the component in addition to or in substitution for actuation. Furthermore, the invention exploits the variable stiffness properties of the VSM structures to enable new functionalities impossible to realize with conventional constant stiffness materials.

US Patent:

8029164, Oct 4, 2011

Filed:

May 21, 2008

Appl. No.:

12/154314

Inventors:

William R. Livesay - San Diego CA, US
Scott M. Zimmerman - Basking Ridge NJ, US
Richard L. Ross - Del Mar CA, US

Assignee:

Goldeneye, Inc. - San Diego

International Classification:

F21V 7/00

US Classification:

362310, 362247, 362298, 362341

Abstract:

A light emitting diode light source with mirrored surfaces is formed on a planar substrate which, when folded, forms both a light recycling cavity and an optical taper at the end of the light recycling cavity.

US Patent:

8029165, Oct 4, 2011

Filed:

May 21, 2008

Appl. No.:

12/154318

Inventors:

William R. Livesay - San Diego CA, US
Scott M. Zimmerman - Basking Ridge NJ, US
Richard L. Ross - Del Mar CA, US

Assignee:

Goldeneye, Inc. - San Diego CA

International Classification:

F21V 7/00

US Classification:

362310, 362247, 362298, 362341

Abstract:

LEDs are mounted onto a flat, thermally conductive, substrate, which is folded to form a light recycling cavity. A planar substrate is first coated with a metal layer, which is patterned to electrically connect the LEDs and to form bonding pads for wirebonds to connect the LEDs to external circuitry. The LEDs are mounted on the substrate. The substrate is then scribed on the backside to form the folds. The LED dies are then attached onto the metal islands (pads) defined on the substrate and wirebonds are used to connect the top side of the LED to adjacent patterned metal islands (pads) on the substrate. The substrate is then folded into a light recycling cavity where the LEDs are facing the inside of the cavity.

US Patent:

8158983, Apr 17, 2012

Filed:

Dec 23, 2008

Appl. No.:

12/317635

Inventors:

Karl W. Beeson - Princeton NJ, US
Scott M. Zimmerman - Basking Ridge NJ, US
William R. Livesay - San Diego CA, US
Richard L. Ross - Del Mar CA, US

Assignee:

Goldeneye, Inc. - San Diego CA

International Classification:

H01L 33/00
H01L 31/101

US Classification:

257 72, 257 59, 257291, 257432, 257E33005, 257E31054, 257 88

Abstract:

A substrate-free semiconducting sheet has an array of semiconducting elements dispersed in a matrix material. The matrix material is bonded to the edge surfaces of the semiconducting elements and the substrate-free semiconducting sheet is substantially the same thickness as the semiconducting elements.

US Patent:

8197102, Jun 12, 2012

Filed:

Oct 3, 2011

Appl. No.:

13/200896

Inventors:

William R. Livesay - San Diego CA, US
Scott M. Zimmerman - Basking Ridge NJ, US
Richard L. Ross - Del Mar CA, US

Assignee:

Goldeneye, Inc. - San Diego CA

International Classification:

F21V 7/00

US Classification:

362310, 362247, 362298, 362341

Abstract:

LEDs are mounted onto a flat, thermally conductive, substrate, which is folded to form a light recycling cavity. A planar substrate is first coated with a metal layer, which is patterned to electrically connect the LEDs and to form bonding pads for wirebonds to connect the LEDs to external circuitry. The LEDs are mounted on the substrate. The substrate is then scribed on the backside to form the folds. The LED dies are then attached onto the metal islands (pads) defined on the substrate and wirebonds are used to connect the top side of the LED to adjacent patterned metal islands (pads) on the substrate. The substrate is then folded into a light recycling cavity where the LEDs are facing the inside of the cavity.