Robert F Braun

US Patent:

45104468, Apr 9, 1985

Filed:

Nov 3, 1982

Appl. No.:

6/438768

Inventors:

Robert E. Braun - Norristown PA
John E. Benasutti - North Wales PA

Assignee:

Burroughs Corporation - Detroit MI

International Classification:

G01R 3122

US Classification:

324158R

Abstract:

The present disclosure describes test coupons having predetermined respective test patterns, formed in a multilayer printed circuit board simultaneously with the fabrication of the latter. The test coupons are probed with conventional electrical instruments to provide information as to the occurrence of a misregistration of any given subsurface printed plane or trace, whether or not the misregistration exceeds a specified limit, and if desired, a measure of the degree of misregistration. The foregoing are readily accomplished in a time and cost efficient manner without the need for cross-sectioning portions of the board and the visual observation of the subsurface printed layers.

US Patent:

55863388, Dec 17, 1996

Filed:

Dec 22, 1994

Appl. No.:

8/362297

Inventors:

Richard Lynch - Yardley PA
Robert T. Braun - Pittstown NJ
Michael Haberman - Morris Plains NJ
Edward J. Donofrio - Washington NJ
John G. Nightingale - Jamesburg NJ

Assignee:

Bell Atlantic Mobile Systems, Inc. - Bedminster NJ

International Classification:

H04Q 700
H04Q 900

US Classification:

455 341

Abstract:

A cellular telephone system is upgraded by modifying subscriber units for selective service provider acquisition during roaming. Priority of acquisition is given to those service providers associated with the home service provider. These preferred service providers are identified by System Identification (SIDs) numbers. A roaming subscriber unit will tune to control frequencies to identify all of the system providers operating in a physical area to which the subscriber has roamed. The SIDs of those system providers available are compared to a list contained within the subscriber unit. Selection is made based upon a priority of those system providers having arrangements with the home system provider.

US Patent:

39558673, May 11, 1976

Filed:

Oct 9, 1974

Appl. No.:

5/513278

Inventors:

Robert E. Braun - Norristown PA
George J. Sprenkle - Phoenixville PA

Assignee:

Burroughs Corporation - Detroit MI

International Classification:

H01K 112

US Classification:

339 17CF

Abstract:

A connector or receptacle is described for connecting a leadless integrated circuit package to an interconnection medium such as a printed circuit board without the need for soldering connections. A significant feature of the connector is that all of its electrical contacts may be engaged or probed individually or collectively from the package side of the interconnection board for diagnostic and test purposes. Probe means suitable for use with the connector are also described.

US Patent:

43386210, Jul 6, 1982

Filed:

Feb 4, 1980

Appl. No.:

6/118496

Inventors:

Robert E. Braun - Norristown PA

Assignee:

Burroughs Corporation - Detroit MI

International Classification:

H01L 2302
H01L 2312
H01L 3902

US Classification:

357 74

Abstract:

The present disclosure describes an hermetically sealed integrated circuit package capable of accommodating high density circuit configurations with their attendant high power levels. In performing this function, the package permits the back-bonded integrated circuit chip or die to be mounted to a thermally conductive member of the package which is disposed in an open air stream. Moreover, the opposite side of the package positioned in proximity to the interconnection medium remains available to be fully populated by a large number of closely spaced input/output pins.

US Patent:

49874780, Jan 22, 1991

Filed:

Feb 20, 1990

Appl. No.:

7/481252

Inventors:

Robert E. Braun - Norristown PA
Ronald T. Gibbs - King of Prussia PA

Assignee:

Unisys Corporation - Blue Bell PA

International Classification:

H01L 2302
H01L 2312
H01L 3902
H01L 2342

US Classification:

357 81

Abstract:

An hermetic integrated circuit package having a single die wherein wire connections to area pads on the active face of the die are carried through an hermetic boundary comprised of a cover plate to an external interface with the next succeeding interconnect level. The package is comprised of a heat exchange element to which the die is attached, a cover plate having holes homologously positioned with respect to the area pads on the die and a seal ring for joining the heat exchange element to the cover plate. The wire connections which are carried through the holes and sealed to the cover plate are externally accessible.

US Patent:

39462765, Mar 23, 1976

Filed:

Oct 9, 1974

Appl. No.:

5/513283

Inventors:

Robert E. Braun - Norristown PA
Richard H. Jones - Wayne PA
George J. Sprenkle - Phoenixville PA
Herbert Stopper - Orchard Lake MI

Assignee:

Burroughs Corporation - Detroit MI

International Classification:

H01L 2324

US Classification:

317100

Abstract:

A system is described which provides for high density packaging of electronic equipment, particularly data processing systems. Subnanosecond integrated circuits of the LSI or MSI type in pluggable packages are adapted to be installed in receptacles or connectors. A cooling frame is provided which supports the package connectors as well as the package-to-package interconnection medium. In accordance with the system, groups of integrated circuit packages logically partitioned into functional elements and having, for example, gate complexities of the order of four thousand to ten thousand gates, comprise an island. The system may be expanded further by interconnecting several islands.

US Patent:

57616183, Jun 2, 1998

Filed:

Dec 22, 1994

Appl. No.:

8/362306

Inventors:

Richard Lynch - Yardley PA
Robert T. Braun - Pittstown NJ
Michael Haberman - Morris Plains NJ

Assignee:

Bell Atlantic Mobile Systems, Inc. - Bedminster NJ

International Classification:

H04Q 720
H04Q 738

US Classification:

455419

Abstract:

A cellular telephone system is upgraded by modifying subscriber units for selective service provider acquisition during roaming. Priority of acquisition is given to those service providers associated with the home service provider. These preferred service providers are identified by System Identification (SIDs) numbers. A roaming subscriber unit will tune to control frequencies to identify all of the system providers operating in a physical area to which the subscriber has roamed. The SIDs of those system providers available are compared to a preferred SID list contained within the subscriber unit. Selection is made based upon a priority of those system providers having arrangements with the home system provider. The SID lists in the subscriber units are modified based upon a version number for each update on the SID list.

US Patent:

50310259, Jul 9, 1991

Filed:

Feb 20, 1990

Appl. No.:

7/481919

Inventors:

Robert E. Braun - Norristown PA
Ronald T. Gibbs - King of Prussia PA

Assignee:

Unisys Corporation - Blue Bell PA

International Classification:

H01L 2304
H01L 2302

US Classification:

357 74

Abstract:

An individual integrated circuit package utilizing an intermediate die carrier having legs in contact with a wiring substrate and a compatible lid to effect hermeticity. More specifically, the carrier includes on its outer surface a raised section and a peripheral ledge. The cap is formed with a cutout in its closed extremity to accommodate the raised carrier section and the portions of the cap adjacent the cutout rest upon and are sealed to the carrier ledge. The rim of the cap at its open extremity contacts and is sealed to the substrate to form the completed hermetic package.