Sarah Mae Brosnan

US Patent:

20210115300, Apr 22, 2021

Filed:

Oct 22, 2020

Appl. No.:

17/077295

Inventors:

- Aurora IL, US
Fernando HUNG LOW - Naperville IL, US
Sarah BROSNAN - St. Charles IL, US
Brian REISS - Woodridge IL, US
Sajo NAIK - Naperville IL, US

International Classification:

C09G 1/02
C09K 3/14
B24B 37/04

Abstract:

A chemical mechanical polishing composition for polishing a substrate having a silicon oxygen material includes a liquid carrier, cubiform ceria abrasive particles dispersed in the liquid carrier, and an organic diacid.

US Patent:

20210115301, Apr 22, 2021

Filed:

Oct 22, 2020

Appl. No.:

17/077414

Inventors:

- Aurora IL, US
Sarah BROSNAN - St. Charles IL, US
Brittany JOHNSON - Wood Dale IL, US
Jinfeng WANG - Naperville IL, US
Alexander W. HAINS - Aurora IL, US

International Classification:

C09G 1/02
C09G 1/16

Abstract:

A chemical mechanical polishing composition for polishing a substrate having a silicon oxygen material comprises, consists of, or consists essentially of a liquid carrier, cubiform ceria abrasive particles dispersed in the liquid carrier, a self-stopping agent, and a cationic polymer.

US Patent:

20210115302, Apr 22, 2021

Filed:

Oct 22, 2020

Appl. No.:

17/077485

Inventors:

- Aurora IL, US
Alexander W. HAINS - Aurora IL, US
Sarah BROSNAN - St. Charles IL, US
Steven KRAFT - Elgin IL, US

International Classification:

C09G 1/02
C09G 1/16

Abstract:

A chemical mechanical polishing composition for polishing a substrate having a silicon oxygen material includes a liquid carrier, cubiform ceria abrasive particles dispersed in the liquid carrier, and at least one of an anionic compound and a nonionic compound.

US Patent:

20210008687, Jan 14, 2021

Filed:

Jul 8, 2020

Appl. No.:

16/923688

Inventors:

- Aurora IL, US
Lin Fu - Rancho Palos Verdes CA, US
Chen-Chih Tsai - Naperville IL, US
Jaeseck Lee - Beaverton OR, US
Sarah Brosnan - St. Charles IL, US

International Classification:

B24B 37/24

Abstract:

A chemical-mechanical polishing pad comprising a thermosetting polyurethane polishing layer includes an isocyanate-terminated urethane prepolymer, a polyamine curative, and a cyclohexanedimethanol curative. The polyamine curative and the cyclohexanedimethanol curative are in a molar ratio of polyamine curative to cyclohexanedimethanol curative in a range from about 20:1 to about 1:1.

US Patent:

20200190361, Jun 18, 2020

Filed:

Feb 21, 2020

Appl. No.:

16/797438

Inventors:

- Aurora IL, US
Juyeon Chang - Hwaseong-si, KR
Tina C. Li - Woodland Hills CA, US
Viet Lam - Irvine CA, US
Ji Cui - Hsin-Chu, TW
Sarah Brosnan - St. Charles IL, US
Chul Woo Nam - Naperville IL, US

International Classification:

C09G 1/02
H01L 21/3105
H01L 21/762

Abstract:

The invention provides a chemical-mechanical polishing composition comprising an abrasive, a self-stopping agent, an aqueous carrier, and a cationic polymer. This invention additionally provides a method suitable for polishing a dielectric substrate.

US Patent:

20190284434, Sep 19, 2019

Filed:

Mar 14, 2018

Appl. No.:

15/920813

Inventors:

- Aurora IL, US
Sarah Brosnan - St. Charles IL, US

International Classification:

C09G 1/02
H01L 21/3105
B24B 37/04

Abstract:

The invention relates to a chemical-mechanical polishing composition comprising () ceria abrasive particles, () a cationic polymer, () a nonionic polymer comprising polyethylene glycol octadecyl ether, polyethylene glycol lauryl ether, polyethylene glycol oleyl ether, poly(ethylene)-co-poly(ethylene glycol), octylphenoxy poly(ethyleneoxy)ethanol, or a combination thereof, () a saturated monoacid, and () an aqueous carrier. The invention also relates to a method of polishing a substrate.

US Patent:

20190185716, Jun 20, 2019

Filed:

Feb 8, 2019

Appl. No.:

16/271508

Inventors:

- Aurora IL, US
Juyeon CHANG - Hwaseong-si, KR
Tina C. LI - Warrenville IL, US
Viet LAM - Naperville IL, US
Ji CUI - Hsin-Chu, TW
Sarah BROSNAN - St. Charles IL, US
Chul Woo NAM - Naperville IL, US

International Classification:

C09G 1/02
H01L 21/762
H01L 21/3105

Abstract:

The invention provides a chemical-mechanical polishing composition comprising an abrasive, a self-stopping agent, an aqueous carrier, and optionally, a cationic polymer, and provides a method suitable for polishing a substrate.

US Patent:

20180244956, Aug 30, 2018

Filed:

Mar 23, 2018

Appl. No.:

15/934219

Inventors:

- Aurora IL, US
Juyeon CHANG - Hwaseong-si, KR
Tina C. LI - Warrenville IL, US
Viet LAM - Naperville IL, US
Ji CUI - Hsin-Chu, TW
Sarah BROSNAN - St. Charles IL, US
Chul Woo NAM - Naperville IL, US

International Classification:

C09G 1/02
H01L 21/3105

Abstract:

The invention provides a chemical-mechanical polishing composition comprising an abrasive, a self-stopping agent, an aqueous carrier, and optionally, a cationic polymer, and provides a method suitable for polishing a substrate.