A surface acoustic wave (SAW) circuit package and a method of fabricating the package. In one embodiment, the package includes: (1) a substantially planar piezoelectric substrate, (2) SAW circuit conductors located over the substrate and (3) a passivation layer located over the SAW circuit conductors, the substrate and the passivation layer cooperating to form a hermetic seal to isolate the SAW circuit conductors from an environment proximate the package.
Wafer-Scale Package For Surface Acoustic Wave Circuit And Method Of Manufacturing The Same
Martin Goetz - Dallas TX, US Sarah Schwab - Dallas TX, US
International Classification:
H03H009/64
US Classification:
333/193000, 310/31300R
Abstract:
A surface acoustic wave (SAW) circuit package and a method of fabricating the package. In one embodiment, the package includes: (1) a substantially planar piezoelectric substrate, (2) SAW circuit conductors located over the substrate and (3) a passivation layer located over the SAW circuit conductors, the substrate and the passivation layer cooperating to form a hermetic seal to isolate the SAW circuit conductors from an environment proximate the package.
Andrew Hillger, Stephanie Jackson, Jennifer Goforth, Felicia Hayes, Megan Greenwalt, Daniel Garrett, Martin Honeywell, Donnie Copeland, Toni Spaulding, Joe Doe, Sabrina Hayes