Stephen Michael Hooper

US Patent:

7014888, Mar 21, 2006

Filed:

Dec 23, 2002

Appl. No.:

10/326675

Inventors:

William G. McDonald - Scottsdale AZ, US
Stephen Ryan Hooper - Mesa AZ, US

Assignee:

Freescale Semiconductor, Inc. - Austin TX

International Classification:

B05D 1/32
B05D 3/06
B05D 7/20

US Classification:

427558, 427154, 427259, 427264, 427273, 427282

Abstract:

A method and structure that protects interior electrical components of a pressure sensor () from corrosive particles using a sacrificial gel dome () to form a vent () in a protective gel () that covers electrical components that can be corroded such as wires (), bond pads (), and electrical leads (). Sacrificial gel dome () is dispensed over a diaphragm () of pressure sensor () to form vent () enabling diaphragm () to sense pressure variations without the influence of protective gel (). Sacrificial gel dome () is removed through a water rinsing process () to expose vent ().

US Patent:

7109055, Sep 19, 2006

Filed:

Jan 20, 2005

Appl. No.:

11/039688

Inventors:

William G. McDonald - Scottsdale AZ, US
Stephen R. Hooper - Mesa AZ, US
Arvind S. Salian - Chandler AZ, US

Assignee:

Freescale Semiconductor, Inc. - Austin TX

International Classification:

H01L 21/00

US Classification:

438 51, 438 26, 438127, 257417, 257788, 257792

Abstract:

Methods are provided for manufacturing a sensor. The method comprises depositing a sacrificial material at a first predetermined thickness onto a wafer having at least one sense element mounted thereon, the sacrificial material deposited at least partially onto the at least one sense element, forming an encapsulating layer at a second predetermined thickness less than the first predetermined thickness over the wafer and around the deposited sacrificial material, and removing the sacrificial material. Apparatus for a sensor manufactured by the aforementioned method are also provided.

US Patent:

7316965, Jan 8, 2008

Filed:

Jun 21, 2005

Appl. No.:

11/158793

Inventors:

Stephen R. Hooper - Mesa AZ, US
Hemant D. Desai - Gilbert AZ, US
William G. McDonald - Scottsdale AZ, US
Arvind S. Salian - Chandler AZ, US

Assignee:

Freescale Semiconductor, Inc. - Austin TX

International Classification:

H01L 21/00

US Classification:

438460, 257E21238

Abstract:

A MEMS device () is provided that includes a handle layer () having a sidewall (), a cap () overlying said handle layer (), said cap () having a sidewall (), and a conductive material () disposed on at least a portion of said sidewall of said cap () and said sidewall of said handle layer () to thereby electrically couple said handle layer () to said cap (). A wafer-level method for manufacturing the MEMS device from a substrate () comprising a handle layer () and a cap () overlying the handle layer () is also provided. The method includes making a first cut through the cap () and at least a portion of the substrate () to form a first sidewall (), and depositing a conductive material () onto the first sidewall () to electrically couple the cap () to the substrate ().

US Patent:

7528468, May 5, 2009

Filed:

Sep 25, 2006

Appl. No.:

11/526971

Inventors:

Andrew C. McNeil - Chandler AZ, US
Dubravka Bilic - Scottsdale AZ, US
Stephen R. Hooper - Mesa AZ, US

Assignee:

Freescale Semiconductor, Inc. - Austin TX

International Classification:

H01L 23/552

US Classification:

257659, 257296, 257297, 257298, 257300, 257312, 257313, 257532, 257E27017, 257E27019, 257E27025, 257E2703, 257E27031

Abstract:

A capacitor assembly () is formed on a substrate (). The capacitor assembly a first conductive plate () and a second conductive plate () formed over the substrate such that the second conductive plate is separated from the first conductive plate by a distance. A conductive trace () is formed over the substrate that is connected to the first conductive plate and extends away from the capacitor assembly. A conductive shield () is formed over at least a portion of the conductive trace that is separated from the first and second conductive plates to control a fringe capacitance between the second conductive plate and the conductive trace.

US Patent:

7632698, Dec 15, 2009

Filed:

May 16, 2006

Appl. No.:

11/383649

Inventors:

Stephen R. Hooper - Mesa AZ, US
David E. Heeley - Glendale AZ, US

Assignee:

Freescale Semiconductor, Inc. - Austin TX

International Classification:

H01L 21/00

US Classification:

438 51, 438 50, 438 53, 257E21502

Abstract:

A device () may have a pressure sensitive portion () which is protected from corrosion by a pressure transmitting material (). Pressure transmitting material () may also be used to transmit pressure to pressure sensitive portion (). A masking material () may be used to define an opening () in encapsulating material ().

US Patent:

7834431, Nov 16, 2010

Filed:

Apr 8, 2008

Appl. No.:

12/099446

Inventors:

Stephen R. Hooper - Mesa AZ, US
James D. MacDonald - Chandler AZ, US
Russell S. Shumway - Gilbert AZ, US

Assignee:

Freescale Semiconductor, Inc. - Austin TX

International Classification:

H01L 23/495

US Classification:

257667, 257676, 257E23037, 257E2305

Abstract:

A packaged electronic device () includes a die pad (), leads () arranged around the die pad (), and a die () attached to an upper surface () of the die pad () and electrically connected to the leads (). A packaging material () encapsulates the die pad (), the die (), and the leads (). The die pad () includes indentations () formed in the upper surface () along a sidewall () of the die pad (). The die pad () further includes indentations () formed in a lower surface () of the die pad () along the sidewall. The packaging material () fills the indentations () thereby promoting adhesion between the die pad () and the packaging material () so that the die pad () and packaging material () cannot readily delaminate.

US Patent:

7859068, Dec 28, 2010

Filed:

Nov 3, 2009

Appl. No.:

12/611586

Inventors:

Stephen R. Hooper - Mesa AZ, US
David E. Heeley - Glendale AZ, US

Assignee:

Freescale Semiconductor, Inc. - Austin TX

International Classification:

H01L 29/78

US Classification:

257415, 257417, 257E23002

Abstract:

A device () may have a pressure sensitive portion () which is protected from corrosion by a pressure transmitting material (). Pressure transmitting material () may also be used to transmit pressure to pressure sensitive portion (). A masking material () may be used to define an opening () in encapsulating material ().

US Patent:

7900521, Mar 8, 2011

Filed:

Feb 10, 2009

Appl. No.:

12/368402

Inventors:

Stephen R. Hooper - Mesa AZ, US
James D. MacDonald - Chandler AZ, US
William G. McDonald - Payson AZ, US

Assignee:

Freescale Semiconductor, Inc. - Austin TX

International Classification:

G01L 7/00

US Classification:

73756

Abstract:

A method and apparatus are described for fabricating an exposed backside pressure sensor () which protects interior electrical components () formed on a topside surface of a pressure sensor transducer die () from corrosive particles using a protective gel layer () and molding compound (), but which vents a piezoresistive transducer sensor diaphragm () formed on a backside of the pressure sensor transducer die () through a vent hole () formed in an exposed die flag (), enabling the sensor diaphragm () to directly sense pressure variations without the influence of a protective gel.