Tae Hak Chung

US Patent:

8310041, Nov 13, 2012

Filed:

Nov 24, 2010

Appl. No.:

12/954489

Inventors:

Tae Seung Chung - San Jose CA, US

Assignee:

Polystak, Inc. - San Jose CA

International Classification:

H01L 23/48

US Classification:

257696, 257E23048

Abstract:

A stacked semiconductor package technique applicable to semiconductor chips having pins short enough that the semiconductor chips cannot be directly bonded together is provided. A printed circuit board (PCB) is inserted into a space between pins of an upper semiconductor chip and the exterior of bodies of stacked semiconductor chips. The PCB includes a plurality of conductive patterns at locations corresponding to the respective pins. The respective conductive patterns and the corresponding respective pins of the upper and lower semiconductor chips are bonded together. The PCB includes a plurality of recess patterns on one side, the recess patterns having the same pitch as the pins of the semiconductor chips. The PCB is disposed across the pins of the lower semiconductor chip, and thereby easily arranged with the stacked semiconductor chips.

US Patent:

8466008, Jun 18, 2013

Filed:

Aug 9, 2012

Appl. No.:

13/571262

Inventors:

Tae Seung Chung - San Jose CA, US

Assignee:

Polystak, Inc. - San Jose CA

International Classification:

H01L 21/44

US Classification:

438109, 257E21614

Abstract:

A stacked semiconductor package technique applicable to semiconductor chips having pins short enough that the semiconductor chips cannot be directly bonded together is provided. A printed circuit board (PCB) is inserted into a space between pins of an upper semiconductor chip and the exterior of bodies of stacked semiconductor chips. The PCB includes a plurality of conductive patterns at locations corresponding to the respective pins. The respective conductive patterns and the corresponding respective pins of the upper and lower semiconductor chips are bonded together. The PCB includes a plurality of recess patterns on one side, the recess patterns having the same pitch as the pins of the semiconductor chips. The PCB is disposed across the pins of the lower semiconductor chip, and thereby easily arranged with the stacked semiconductor chips.