Thomas A Wieder

US Patent:

8518865, Aug 27, 2013

Filed:

Aug 19, 2010

Appl. No.:

12/859624

Inventors:

Madhukar Bhaskara Rao - Fogelsville PA, US
Gautam Banerjee - Chandler AZ, US
Thomas Michael Wieder - Emmaus PA, US
Yi-Chia Lee - Danshuei Jen Taipei, TW
Wen Dar Liu - Chupei, TW
Aiping Wu - Macungie PA, US

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

C11D 7/50
C11D 11/00

US Classification:

510175, 510176

Abstract:

The present invention relates to water-rich formulations and the method using same, to remove bulk photoresists, post-etched and post-ashed residues, residues from Al back-end-of-the-line interconnect structures, as well as contaminations. The formulation comprises: hydroxylamine; corrosion inhibitor containing a mixture of alkyl dihydroxybenzene and hydroxyquinoline; an alkanolamine, a water-soluble solvent or the combination of the two; and at least 50% by weight of water.

US Patent:

20070179072, Aug 2, 2007

Filed:

Jan 30, 2006

Appl. No.:

11/342414

Inventors:

Madhukar Rao - Fogelsville PA, US
Thomas Wieder - Emmaus PA, US
John Marsella - Allentown PA, US
Mark Listemann - Kutztown PA, US

International Classification:

C23G 1/00
C11D 7/32

US Classification:

510175000, 134002000

Abstract:

The present invention relates to an aqueous cleaning composition used to remove unwanted organic and inorganic residues and contaminants from semiconductor substrates. The cleaning composition comprises a urea derivative such as, for example, dimethyl urea, as the component that is principally responsible for removing organic residues from the substrate. A fluoride ion source is also included in the cleaning compositions of the present invention and is principally responsible for removing inorganic residues from the substrate. The cleaning compositions of the present invention have a low toxicity and are environmentally acceptable.