Vinh Hau Diep

US Patent:

7539015, May 26, 2009

Filed:

Jul 31, 2007

Appl. No.:

11/831214

Inventors:

Gregory Springer - Sunnyvale CA, US
Vinh Diep - Milpitas CA, US
Ricardo Mariano - Hayward CA, US
Douglas L. Heirich - Palo Alto CA, US

Assignee:

Apple Inc. - Cupertino CA

International Classification:

H05K 7/20

US Classification:

361695, 361694, 361831, 454184

Abstract:

A housing for accommodating one or more riser cards is disclosed. The one or more riser cards include a first riser card. The first riser card may be configured to carry at least a first component. The housing may include a first inlet side configured to allow first air to flow into the housing for cooling the first component. The housing may also include an outlet side configured to allow at least a first portion of the first air to flow away from the housing. The housing may be configured to be disposed inside an enclosure of an electronic device. At least one of the first inlet side and the outlet side may include a first guiding structure configured to guide movement of the first riser card relative to the housing.

US Patent:

8493740, Jul 23, 2013

Filed:

Jul 1, 2011

Appl. No.:

13/175673

Inventors:

Vinh H. Diep - Milpitas CA, US
Giles Matthew Lowe - San Francisco CA, US
Phillip Satterfield - East Palo Alto CA, US
Clark Everett Waterfall - Campbell CA, US
Alex Chun lap Yeung - South San Francisco CA, US

Assignee:

Apple Inc. - Cupertino CA

International Classification:

H05K 5/00

US Classification:

361732, 361747, 361803

Abstract:

A component retention mechanism facilitates improved installation, retention and removal of hardware components (e. g. , PCI cards) on a personal computer. The retention mechanism includes a locking component, support member, and release mechanism coupled to each other. The locking component can be a steel bar or other stiff item positioned proximate to multiple socket connectors on a circuit board. The locking component moves between unlocked and locked positions that mechanically and simultaneously unlock or lock in place multiple add-in cards inserted into the socket connectors. The support member moves and thereby facilitates movement of the locking component between locked and unlocked positions. The release mechanism facilitates movement of the support member and is actuated when a force is exerted by a user thereto. An associated slider housing coupled to the release mechanism and support member includes a fan, support shelves and a door that provides additional support to oversized PCI cards.

US Patent:

7995350, Aug 9, 2011

Filed:

Dec 19, 2008

Appl. No.:

12/340413

Inventors:

Vinh H. Diep - Milpitas CA, US
Giles Matthew Lowe - San Francisco CA, US
Phillip Satterfield - East Palo Alto CA, US
Clark Everett Waterfall - Campbell CA, US
Alex Chun lap Yeung - South San Francisco CA, US

Assignee:

Apple Inc. - Cupertino CA

International Classification:

H05K 5/00

US Classification:

361732, 361801, 361803

Abstract:

A component retention mechanism facilitates improved installation, retention and removal of hardware components (e. g. , PCI cards) on a personal computer. The retention mechanism includes a locking component, support member, and release mechanism coupled to each other. The locking component can be a steel bar or other stiff item positioned proximate to multiple socket connectors on a circuit board. The locking component moves between unlocked and locked positions that mechanically and simultaneously unlock or lock in place multiple add-in cards inserted into the socket connectors. The support member moves and thereby facilitates movement of the locking component between locked and unlocked positions. The release mechanism facilitates movement of the support member and is actuated when a force is exerted by a user thereto. An associated slider housing coupled to the release mechanism and support member includes a fan, support shelves and a door that provides additional support to oversized PCI cards.

US Patent:

20110163642, Jul 7, 2011

Filed:

Jan 6, 2010

Appl. No.:

12/683328

Inventors:

Matthew D. Rohrbach - San Francisco CA, US
Vinh Diep - Milpitas CA, US

Assignee:

Apple Inc. - Cupertino CA

International Classification:

A47B 81/00
B23P 11/00

US Classification:

3122231, 29428

Abstract:

This is directed to a case for securing and protecting an electronic device. The case can include a cover connected to a pouch by a hinge such that the cover can be overlaid over a device interface (e.g., a device display). The case can be constructed by layering and combining several types of materials, including for example materials having resistant outer surfaces, materials limiting the deformation of the case, materials providing a soft surface to be placed in contact with the device, and rigid materials for defining a structure of the case. In some embodiments, the case can include a tab that allows a user to fold open the cover of the case to form a triangular prism. The prism can be placed on any of its surfaces such that the device can be oriented towards a user at particular angles (e.g., a typing-specific orientation and a media playback orientation).

US Patent:

20110281044, Nov 17, 2011

Filed:

May 17, 2010

Appl. No.:

12/781761

Inventors:

Spyros Michail - Livermore CA, US
Kevin Kenney - San Jose CA, US
Tommy Tang - Yonghe City, TW
Vinh Diep - Milpitas CA, US
Shannon Hsueh - Taipei, TW
Dan Hong - Los Altos CA, US

International Classification:

B32B 5/26
B32B 5/28
B32B 17/04
B65H 81/00

US Classification:

428 345, 156184, 428 364

Abstract:

Composite structures may be formed using sheets of unidirectional fiber prepreg. Each of the prepreg sheets may include unidirectional fibers such as glass fibers and a binder such as plastic. The prepreg sheets may be wrapped around the outer surface of a drum. Ring-shaped sections of the wrapped sheets may be cut from the drum to form rings of prepreg layers. The prepreg rings may be placed into a mold cavity of a desired shape. While contained in stack of molds, prepreg rings may be cured by applying heat and pressure. Finished composite structures such as ring-shaped composite structures may be released from the molds following curing. The composite structures may be planar structures that have planar upper and lower surfaces and inner and outer edges. The fibers in the finished composite structures may run parallel to the upper and lower surfaces and parallel to the inner and outer edges.

US Patent:

20130050943, Feb 28, 2013

Filed:

Aug 30, 2011

Appl. No.:

13/221796

Inventors:

Vinh Diep - Palo Alto CA, US
Chiew-Siang Goh - San Jose CA, US
Doug Heirich - Palo Alto CA, US
Alexander Michael Kwan - Los Altos Hills CA, US

International Classification:

H05K 7/20

US Classification:

361702

Abstract:

An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.

US Patent:

20130050945, Feb 28, 2013

Filed:

Aug 31, 2011

Appl. No.:

13/223030

Inventors:

Vinh Diep - Palo Alto CA, US
Dominic Dolci - Berkeley CA, US
Chiew-Siang Goh - San Jose CA, US
Alexander Michael Kwan - Los Altos Hills CA, US
Cesar Lozano Villarreal - Sunnyvale CA, US

International Classification:

H05K 5/00
H05K 5/02
A47B 87/00
H05K 7/20

US Classification:

361704, 361807, 361752, 312111

Abstract:

An electronic device may have electronic device housing structures in which electronic components such as integrated circuits and connectors may be mounted. The electronic device housing structures may include an upper housing having a planar upper surface member and four perpendicular housing sidewall structures. The housing sidewall structures of the upper housing may have edges that form a rectangular opening with curved corners. A lower housing may have structures forming a rectangular lip that is configured to be received within the rectangular opening in the upper housing. Engagement structures such as inwardly protruding hook structures on the upper housing and snap structures on the rectangular lip may be used in attaching the upper and lower housings. The snap structures may each have a rectangular main opening and lateral extension portions that extend the width of the main opening along the edge of the lip.

US Patent:

20140078677, Mar 20, 2014

Filed:

Sep 20, 2012

Appl. No.:

13/623436

Inventors:

Dominic E. Dolci - Berkeley CA, US
James G. Smeenge - Los Gatos CA, US
Vinh H. Diep - Palo Alto CA, US
Chiew-Siang Goh - San Jose CA, US

International Classification:

H05K 7/20
H05K 9/00

US Classification:

361719, 361704, 361718, 361720

Abstract:

An electronic device may be provided with electronic components such as radio-frequency transceiver integrated circuits and other integrated circuits that are be sensitive to electromagnetic interference. Metal structures are configured to serve both as heat sinking structures for the electrical components and electromagnetic interference shielding. Components are mounted to the substrate using solder. Metal fence structures are also soldered to the substrate. Each metal fence has an opening that covers a respective one of the components. A thermally conductive elastomeric gap filler pad is mounted in the opening. A metal heat spreading structure is electrically shorted to the fence using a conductive gasket that surrounds the gap filler pad so that the structure serves as an electromagnetic interference shield. Heat from the component travels through the gap filler pad to the metal heat spreading structure so that the heat spreading structure may laterally spread and dissipate the heat.