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Wayne H Huang

age ~50

from Boise, ID

Also known as:
  • Wayne Huang
Phone and address:
9905 Countryman Dr, Boise, ID 83709

Wayne Huang Phones & Addresses

  • 9905 Countryman Dr, Boise, ID 83709
  • 3272 Gekeler Ln, Boise, ID 83706
  • 1510 Miles St, Tucson, AZ 85719 • (520)7983892
  • 2233 8Th St, Tucson, AZ 85719
  • 3225 Ina Rd, Tucson, AZ 85741 • (520)7426698
  • Wichita, KS
  • Newton, KS

Education

  • Degree:
    High school graduate or higher

Us Patents

  • Methods Of Removing Particles From Over Semiconductor Substrates

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  • US Patent:
    8226772, Jul 24, 2012
  • Filed:
    Jan 8, 2009
  • Appl. No.:
    12/350789
  • Inventors:
    Neil Joseph Greeley - Boise ID, US
    Dan Millward - Boise ID, US
    Wayne Huang - Boise ID, US
  • Assignee:
    Micron Technology, Inc. - Boise ID
  • International Classification:
    B08B 3/04
  • US Classification:
    134 13, 134 1, 134 33, 134 34
  • Abstract:
    Some embodiments include methods of removing particles from over surfaces of semiconductor substrates. Liquid may be flowed across the surfaces and the particles. While the liquid is flowing, electrophoresis and/or electroosmosis may be utilized to enhance transport of the particles from the surfaces and into the liquid. In some embodiments, temperature, pH and/or ionic strength within the liquid may be altered to assist in the removal of the particles from over the surfaces of the substrates.
  • Methods Of Forming A Memory Cell Having Programmable Material That Comprises A Multivalent Metal Oxide Portion And An Oxygen Containing Dielectric Portion

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  • US Patent:
    8633084, Jan 21, 2014
  • Filed:
    Oct 17, 2012
  • Appl. No.:
    13/654258
  • Inventors:
    Beth R. Cook - Meridian ID, US
    Lei Bi - Boise ID, US
    Wayne Huang - Boise ID, US
    Ian C. Laboriante - Boise ID, US
  • Assignee:
    Micron Technology, Inc. - Boise ID
  • International Classification:
    H01L 21/20
  • US Classification:
    438381, 257E21396
  • Abstract:
    A method of forming a memory cell includes forming one of multivalent metal oxide material or oxygen-containing dielectric material over a first conductive structure. An outer surface of the multivalent metal oxide material or the oxygen-containing dielectric material is treated with an organic base. The other of the multivalent metal oxide material or oxygen-containing dielectric material is formed over the treated outer surface. A second conductive structure is formed over the other of the multivalent metal oxide material or oxygen-containing dielectric material.
  • Methods Of Planarization And Electro-Chemical Mechanical Polishing Processes

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  • US Patent:
    20090239379, Sep 24, 2009
  • Filed:
    Mar 24, 2008
  • Appl. No.:
    12/054077
  • Inventors:
    Wayne Huang - Boise ID, US
    Whonchee Lee - Boise ID, US
  • International Classification:
    H01L 21/306
  • US Classification:
    438692, 257E2123
  • Abstract:
    A method of removing a material from a surface includes providing a substrate comprising a material having a surface, contacting the surface with a polishing medium, applying a voltage to the substrate to remove material from the surface, and changing the voltage during the removing material from the surface. An electrochemical mechanical polishing method includes providing a substrate having a surface, applying a platen to the surface, applying a first voltage to the substrate, rotating the platen and surface relative to each other at a first rotational speed, increasing to a second voltage, and decreasing to a second rotational speed.
  • Methods Of Removing Particles From Over Semiconductor Substrates

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  • US Patent:
    20120266913, Oct 25, 2012
  • Filed:
    Jun 27, 2012
  • Appl. No.:
    13/535322
  • Inventors:
    Neil Joseph Greeley - Boise ID, US
    Dan Millward - Boise ID, US
    Wayne Huang - Boise ID, US
  • Assignee:
    MICRON TECHNOLOGY, INC. - Boise ID
  • International Classification:
    B08B 3/10
  • US Classification:
    134 13
  • Abstract:
    Some embodiments include methods of removing particles from over surfaces of semiconductor substrates. Liquid may be flowed across the surfaces and the particles. While the liquid is flowing, electrophoresis and/or electroosmosis may be utilized to enhance transport of the particles from the surfaces and into the liquid. In some embodiments, temperature, pH and/or ionic strength within the liquid may be altered to assist in the removal of the particles from over the surfaces of the substrates.
  • Substrates Comprising Integrated Circuitry, Methods Of Processing A Substrate Comprising Integrated Circuitry, And Methods Of Back-Side Thinning A Substrate Comprising Integrated Circuitry

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  • US Patent:
    20130313718, Nov 28, 2013
  • Filed:
    May 24, 2012
  • Appl. No.:
    13/480341
  • Inventors:
    Sony Varghese - Boise ID, US
    Andrew Carswell - Boise ID, US
    Kozaburo Sakai - Boise ID, US
    Andrey V. Zagrebelny - Eagan MN, US
    Wayne Huang - Boise ID, US
    Jin Lu - Boise ID, US
    Suresh Ramakrishnan - Boise ID, US
  • Assignee:
    MICRON TECHNOLOGY, INC. - Boise ID
  • International Classification:
    H01L 23/498
    H01L 21/66
    H01L 21/768
  • US Classification:
    257774, 438667, 438 16, 257E23067, 257E2153, 257E21577
  • Abstract:
    A method of processing a substrate having integrated circuitry includes forming through-substrate vias partially through the substrate from a first side of the substrate. At least one through-substrate structure is formed partially through the substrate from the first substrate side. The at least one through-substrate structure extends deeper into the substrate than do the through-substrate vias. Substrate material is removed from a second side of the substrate to expose the through-substrate vias and the at least one through-substrate structure on the second substrate side. Additional implementations are disclosed. Integrated circuit substrates are disclosed independent of method of manufacture.
  • Devices, Systems, And Methods Related To Planarizing Semiconductor Devices After Forming Openings

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  • US Patent:
    20140004698, Jan 2, 2014
  • Filed:
    Jun 29, 2012
  • Appl. No.:
    13/538272
  • Inventors:
    Wayne H. Huang - Boise ID, US
    Anurag Jindal - Boise ID, US
  • Assignee:
    MICRON TECHNOLOGY, INC. - Boise ID
  • International Classification:
    H01L 21/28
  • US Classification:
    438653, 438672, 438667, 257E21158
  • Abstract:
    Methods for making semiconductor devices are disclosed herein. A method configured in accordance with a particular embodiment includes forming a stop layer and a dielectric liner including dielectric material along sidewalls of openings, e.g., through-substrate openings, of the semiconductor device and excess dielectric material outside the openings. The method further includes forming a metal layer including metal plugs within the openings and excess metal. The excess metal and the excess dielectric material are simultaneously chemically-mechanically removed using a slurry including ceria and ammonium persulfate. The slurry is selected to cause selectivity for removing the excess dielectric material relative to the stop layer greater than about 5:1 as well as selectivity for removing the excess dielectric material relative to the excess metal from about 0.5:1 to about 1.5:1.

Resumes

Wayne Huang Photo 1

Process Engineer

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Location:
Boise, ID
Industry:
Semiconductors
Work:
Ekc Technology 2000 - 2000
Intern

Micron Technology 2000 - 2000
Process Engineer
Education:
University of Arizona 1996 - 2003
Doctorates, Doctor of Philosophy, Materials Science, Engineering
Skills:
Process Integration
Development
Semiconductors
Packaging
Technology
Process Development
R&D
Integration
Wayne Huang Photo 2

Wayne Huang

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Location:
Boise, ID
Work:
Citi
Customer Service Representative
Wayne Huang Photo 3

Wayne Huang

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Wayne Huang Photo 4

Wayne Huang

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Wayne Huang Photo 5

Wayne Huang

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Wayne Huang Photo 6

Wayne Huang

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Position:
Sr. Software program manager at Seagate Technology
Location:
San Jose, California
Industry:
Computer Software
Work:
Seagate Technology since 2010
Sr. Software program manager

AMD, ATI, ArtX 1999 - 2008
Software engineer/manager/director

Intel, C&T 1995 - 1999
Staff Software Engineer
Education:
Santa Clara University - Leavey School of Business 2008 - 2010
MBA
East China University of Science and Technology
東京農工大学 / Tokyo University of Agriculture and Technology
Skills:
Mandarin, Japanese
Japanese
Device Drivers
Firmware
Android
Mobile Applications
Embedded Systems
Management
Wayne Huang Photo 7

Director Of Quality Assurance Center At Railcomm

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Position:
Director of Quality Assurance Center at RailComm
Location:
Pittsford, New York
Industry:
Computer Software
Work:
RailComm - Fairport, NY since Oct 2012
Director of Quality Assurance Center

RailComm - Fairport, NY May 2011 - Oct 2012
Software Quality Assurance Manager

RailComm - Fairport, NY May 2009 - May 2011
Software Quality Assurance Engineer

Comforce Feb 2008 - May 2009
Software QA Tester at Xerox Corporation
Education:
Western Governors University 2009 - 2011
Master of Business Administration, Information Technology Management
Genesee Community College 2006 - 2007
A.S., Computer Information Systems
State University of New York College at Geneseo 2000 - 2005
B.A., Anthropology
Skills:
Testing
Agile
Test Automation
Test Cases
Requirements Analysis
Team Management
Leadership
Process Improvement
Software Quality Assurance
Cross Functional Relationships
Test Planning
Test Management
Regression Testing
Usability Testing
Manual Testing
System Testing
Problem Solving
Black Box Testing
Agile Testing
Quality Assurance Processes

Vehicle Records

  • Wayne Huang

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  • Address:
    9905 W Countryman Dr, Boise, ID 83709
  • Phone:
    (208)3424168
  • VIN:
    JTEHW21A670042215
  • Make:
    TOYOTA
  • Model:
    HIGHLANDER HYBRID
  • Year:
    2007

Classmates

Wayne Huang Photo 8

Wayne Hunag (Huang)

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Schools:
Lorbeer Middle School Diamond Bar CA 1988-1992
Community:
Yolanda Oglesby, Elaine Fierro, Crystal Waggoner, Andy Montoya, Mike Brandenburg
Wayne Huang Photo 9

Wayne Huang

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Schools:
Regnart Elementary School Cupertino CA 1990-1996, Miller Junior High School San Jose CA 1996-1997, Kennedy Junior High School Cupertino CA 1997-1999
Wayne Huang Photo 10

Wayne Huang

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Schools:
Tilden Junior High School Rockville MD 1988-1989
Community:
Mark Katz, Pamela Gaston
Wayne Huang Photo 11

Wayne Huang

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Schools:
Maple Creek Middle School Port Coquitlam Saudi Arabia 2000-2004
Community:
Tiffany Sutton, Nadine Khayat, Tiffany Jang, Jesseca Egan
Wayne Huang Photo 12

Wayne Huang

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Schools:
Nestor Elementary School Coquitlam Saudi Arabia 1997-2001, Pinetree Secondary High School Coquitlam Saudi Arabia 2004-2008
Wayne Huang Photo 13

Wayne Huang

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Schools:
Zhejiang University Hangzhou China 1999-2003
Community:
Bao Wang, Xiaoxiong Tian, Lisa Chen, Liang Yang
Wayne Huang Photo 14

Nestor Elementary School,...

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Graduates:
Wayne Huang (1997-2001),
Maria Tauriainen (1993-1997),
Shifana Rajabali (1992-1995),
Corey Robinson (1987-1989),
Nicole Minions (1992-1996)
Wayne Huang Photo 15

Tilden Junior High School...

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Graduates:
Felipe Alonso (1983-1986),
Jonathan Hefter (1980-1982),
Wayne Huang (1988-1989),
Amy Keller (1986-1988)

Plaxo

Wayne Huang Photo 16

Wayne Huang

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Axeda

Myspace

Wayne Huang Photo 17

Wayne Huang

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Locality:
Not Cheshire ) :, CALIFORNIA
Gender:
Male
Birthday:
1944
Wayne Huang Photo 18

wayne huang

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Locality:
Lexington, Kentucky
Gender:
Male
Birthday:
1935
Wayne Huang Photo 19

wayne huang

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Locality:
Hamilton, New Jersey
Gender:
Male
Birthday:
1946
Wayne Huang Photo 20

Wayne Huang

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Locality:
Queensland, Australia
Gender:
Male
Birthday:
1949

Youtube

Defcon 18 2010 0box Analyzer Wayne Huang Jere...

  • Category:
    Education
  • Uploaded:
    11 Dec, 2010
  • Duration:
    34m 46s

Defcon 18 - NoSQL No Injection- Wayne Huang K...

Defcon 18

  • Category:
    Education
  • Uploaded:
    12 Dec, 2010
  • Duration:
    31m 55s

Wayne Huang's talk at 2009 Tsinghua Summit No...

2009 Tsinghua Summit Panel Discussion at Santa clara Hilton May 3rd 2009

  • Category:
    Science & Technology
  • Uploaded:
    20 May, 2009
  • Duration:
    10m

Blackhat 2010 Drivesploit Wayne Huang Part

  • Category:
    Education
  • Uploaded:
    10 Dec, 2010
  • Duration:
    51m 51s

DEFCON 18: AfterDark Runtime Forensics for Au...

Speakers: Wayne Huang, Jeremy Chiu (aka Birdman) For antivirus vendors...

  • Category:
    Science & Technology
  • Uploaded:
    04 Oct, 2010
  • Duration:
    14m 58s

Black Hat USA 2010: Drivesploit: Circumventin...

Speakers: Wayne Huang, Caleb Sima This year saw the biggest news in We...

  • Category:
    Science & Technology
  • Uploaded:
    20 Sep, 2010
  • Duration:
    14m 58s

Verizon Presents 7th Annual DC APA Film Festi...

2006 promotional video showing clips from 10 days of festival frenzy S...

  • Category:
    People & Blogs
  • Uploaded:
    09 Jan, 2007
  • Duration:
    11m 45s

DEFCON 18: AfterDark Runtime Forensics for Au...

Speakers: Wayne Huang, Jeremy Chiu (aka Birdman) For antivirus vendors...

  • Category:
    Science & Technology
  • Uploaded:
    04 Oct, 2010
  • Duration:
    4m 52s

Flickr

Facebook

Wayne Huang Photo 29

Wayne Eddie Huang

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Wayne Huang Photo 30

Wayne Huang

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Wayne Huang Photo 31

Wayne Bambi Huang

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Wayne Huang Photo 32

Wayne J Huang

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Wayne Huang Photo 33

Wayne Huang

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Wayne Huang Photo 34

Wayne Huang

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Wayne Huang Photo 35

Wayne Huang

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Wayne Huang Photo 36

Wayne Huang

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Googleplus

Wayne Huang Photo 37

Wayne Huang

Work:
Armorize Technologies - Co-Founder, President and CTO (2010)
Armorize Technologies - Co-Founder & CEO (2005-2010)
Education:
National Taiwan University - Ph.D. EE
Wayne Huang Photo 38

Wayne Huang

Work:
Xcellent - ID (2007)
Education:
實踐大學 - Industial design
Wayne Huang Photo 39

Wayne Huang

Work:
亞光光學 - 自動化工程師
Education:
台中技術學院 - 資訊工程應用研究所
Tagline:
寧可天下人負我,我不負天下人
Wayne Huang Photo 40

Wayne Huang

Work:
Electronic Arts - Software Engineer (2006)
Education:
Simon Fraser University - Computing Science
Wayne Huang Photo 41

Wayne Huang

Work:
Intel Corporation
Education:
Syracuse University, National Cheng Kung University
Wayne Huang Photo 42

Wayne Huang

Education:
淡江高中, 德明技術學院 - 資管
Wayne Huang Photo 43

Wayne Huang

Education:
雲林科大 - EE
Wayne Huang Photo 44

Wayne Huang

Education:
Carnegie Mellon University - Chemical Engineer

News

drive-by download

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  • Four years ago, Wayne Huang left his job researching ways to help secure the Taiwanese government's networks from attacks. He and his brother, Matt Huang, a Stanford MBA graduate, decided to commercialize the research and launched Armorize, which became an anti-malware leader in Asia.
  • Date: May 03, 2012
  • Category: Sci/Tech
  • Source: Google

Mysql.com infects visitors with malware

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  • "It exploits the visitor's browsing platform [...], and upon successful exploitation, permanently installs a piece of malware into the visitor's machine, without the visitor's knowledge," warned Armorize's co-founder and CEO Wayne Huang.
  • Date: Sep 27, 2011
  • Category: Sci/Tech
  • Source: Google

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