Wei-Ning Shen

US Patent:

7728969, Jun 1, 2010

Filed:

Dec 3, 2007

Appl. No.:

11/949473

Inventors:

Jason Saito - Milpitas CA, US
Wei-Ning Shen - Cupertino CA, US

Assignee:

KLA-Tencor Technologies Corp. - Milpitas CA

International Classification:

G01N 21/00

US Classification:

3562375, 3562371

Abstract:

Various methods and systems for identifying defect types on a wafer are provided. One computer-implemented method for identifying defect types on a wafer includes acquiring output of an inspection system for defects detected on a wafer. The output is acquired by different combinations of illumination and collection channels of the inspection system. The method also includes identifying defect types of the defects based on the output acquired by a set of the different combinations. The set of the different combinations is selected based on the defect types to be identified on the wafer and a wafer type of the wafer such that a different set of the different combinations of the illumination and collection channels is used for identifying different defect types on different wafer types.

US Patent:

20070139645, Jun 21, 2007

Filed:

Dec 19, 2005

Appl. No.:

11/311058

Inventors:

Wei-Ning Shen - Cupertino CA, US
Xinkang Tian - San Jose CA, US
Byeong Hwang - San Jose CA, US
Tuan Tran - San Jose CA, US

Assignee:

KLA Tencor, Inc. - Milpitas CA

International Classification:

G01J 1/10

US Classification:

356229000

Abstract:

Calibration of pattern recognition in bright field imaging systems is disclosed. A target pattern on a substrate on the stage is brought into focus of a bright field system. The image is scanned in a first direction while measuring an edge scattering pattern from a feature of the target pattern. The edge scattering pattern is characterized by first and second peaks. A position of the bright field system's illuminator or beam shaping and relay optics is adjusted perpendicular to an optical path until the first and second peaks are approximately equal in height.