Fred I. Nobel - Sands Point NY William R. Brasch - Nesconset NY Anthony J. Drago - East Islip NY
Assignee:
Learonal, Inc. - Freeport NY
International Classification:
C25D 338
US Classification:
205263
Abstract:
A solution for use in electroplating which comprises at least one monovalent metal such as copper, silver or gold which is complexed by a thiosulfate ion; and a stabilizer of an organic sulfinate compound such as, for example, one having the formula R-SO. sub. 2 -X wherein R is an alkyl, heterocyclic or aryl moiety and X is a monovalent cation. The stabilizer is present in an amount sufficient to stabilize the thiosulfate ion when the solution is operated at an acidic pH of less than 7. Also, the solution is substantially free of cyanide.
Fred I. Nobel - Sands Point NY William Brasch - Commack NY
Assignee:
LeaRonal, Inc. - Freeport NY
International Classification:
C25D 346 C25D 510 C25D 534
US Classification:
204 29
Abstract:
The invention relates to silver plating utilizing low cyanide or non-cyanide silver plating baths by treating the substrate to be plated with a mercaptan and to low cyanide or non-cyanide baths containing a bath soluble mercaptan in a sufficient amount to eliminate or effectively reduce immersion plating of the silver onto the substrate.
Fred I. Nobel - Sands Point NY William Brasch - Nesconset NY Donald Thomson - Northport NY Luis H. Garay - Rockville Centre NY
Assignee:
LeaRonal, Inc. - Freeport NY
International Classification:
C25B 100
US Classification:
205488
Abstract:
A method for preparing nickel hypophosphite by contacting a nickel anode with a solution of hypophosphite anions and applying a current through the anode to a counter-electrode in contact with the solution to anodically dissolve the nickel of the anode into the hypophosphite solution, thereby forming a nickel hypophosphite solution. A one-compartment electrolysis cell and a three-or-more-compartment electrodialysis cell embodying the method of the invention are described.
Fred I. Nobel - Sands Point NY William Brasch - Nesconset NY Donald Thomson - Northport NY Luis H. Garay - Rockville Centre NY
Assignee:
LeaRonal Inc. - Freeport NY
International Classification:
C25B 122
US Classification:
204103
Abstract:
Methods for preparing hypophosphorous acid are disclosed comprising contacting an insoluble anode with an aqueous solution of hypophosphite anions and applying a current through the insoluble anode to a cathode in electrical contact with the aqueous solution to generate H+ ions in the aqueous solution thereby forming a hypophosphorous acid solution.
Cyanide-Free Plating Solutions For Monovalent Metals
Fred I. Nobel - Sands Point NY William R. Brasch - Nesconset NY Anthony J. Drago - East Islip NY
Assignee:
Learonal, Inc. - Freeport NY
International Classification:
C25D 338
US Classification:
205296
Abstract:
A solution for use in electroplating which comprises at least one monovalent metal such as copper, silver or gold which is complexed by a thiosulfate ion; and a stabilizer of an organic sulfinate compound such as, for example, one having the formula R-SO. sub. 2 -X wherein R is an alkyl, heterocyclic or aryl moiety and X is a monovalent cation. The stabilizer is present in an amount sufficient to stabilize the thiosulfate ion when the solution is operated at an acidic pH of less than 7. Also, the solution is substantially free of cyanide.
Fred I. Nobel - Sands Point NY William Brasch - Commack NY
Assignee:
LeaRonal, Inc. - Freeport NY
International Classification:
C25D 346 C25D 502 C25D 508
US Classification:
204 15
Abstract:
The invention relates to silver plating utilizing low cyanide or non-cyanide silver plating baths by treating the substrate to be plated with a mercaptan and to low cyanide or non-cyanide baths containing a bath soluble mercaptan in a sufficient amount to eliminate or effectively reduce immersion plating of the silver onto the substrate.
Method Of Improving The Adhesion Of Electroless Metal Deposits Employing Colloidal Copper Activator
The present invention relates to a method for promoting and improving the adhesion of an electroless metal deposit to the metal surface of a composite substrate having both a conductive metal area and an activated non-conductive surface. The process comprises treating such a substrate, subsequent to catalyzation or activation of the substrate, and prior to electroless metal deposition thereon, with an adhesion promotor compound or mixture of compounds.