Maxson Company Ltd Hong Kong, Hong Kong Island Apr 2012 to Apr 2014 Assistant Engineer on government system control projectsNewcom System Ltd
Jul 2011 to Mar 2012 PLC programmerWaika Engineering Ltd Hong Kong, Hong Kong Island Oct 2010 to Jun 2011 Point of Sale system supporting technician (on-call)Unigen Corporation Fremont, CA Mar 2010 to Sep 2010 Technician
Education:
UNIVERSITY OF CALIFORNIA Davis, CA Jun 2007 Bachelor of Science in Computer ScienceUniversity of California Davis, CA High School Education Milpitas High School
Newcom System Ltd Hong Kong, Hong Kong Island Jul 2011 to Mar 2012 PLC ProgrammerWaika Engineering Ltd Hong Kong, Hong Kong Island Oct 2010 to Jun 2011 PLC Programmer AssociateUnigen Corporation Fremont, CA Mar 2010 to Sep 2010 Assistant testing engineer
Education:
UNIVERSITY OF CALIFORNIA Davis, CA Jan 2004 to Jan 2007 Bachelor of Science in Computer ScienceDe Anza College Cupertino, CA Jan 2001 to Jan 2004 U.C. prerequistesMilpitas high School Milpitas, CA Jan 1999 to Jan 2001 GED/High SchoolSt. Paul's College Hong Kong Jan 1995 to Jan 1999 Hong Kong High School Education
Skills:
VB.Net, C, C++, MS. Net, TCP/IP, Eclipse, ARM proceesor, Siemens S7, Rockwell RS Logix [] Unitronics,Microsoft Word, Excel, Powerpoint
Us Patents
Method For Using A Latched Sense Amplifier In A Memory Module As A High-Speed Cache Memory
A fault-tolerant, high-speed wafer scale system includes a plurality of functional memory modules, each having associated sense amplifiers which act as high-speed cache memory, a parallel hierarchical bus which is fault-tolerant to defects and a interconnect network, and one or more bus masters. By grouping the DRAM arrays into logically independent modules of relatively small memory capacity (588 Kbit), a large number of cache lines ( ) is obtained at small main memory capacity (4 Megabytes). The large number of cache lines allows maintaining a high cache hit rate (greater than 90%).
Memory Modules With High Speed Latched Sense Amplifiers
A fault-tolerant, high-speed wafer scale system comprises a plurality of functional modules, a parallel hierarchical bus which is fault-tolerant to defects in an interconnect network, and one or more bus masters. This bus includes a plurality of bus lines segmented into sections and linked together by programmable bus switches and bus transceivers or repeaters in an interconnect network. By: 1) use of small block size (512K bit) for the memory modules; 2) use of programmable identification register to facilitate dynamic address mapping and relatively easy incorporation of global redundancy; 3) Use of a grid structure for the bus to provide global redundancy for the interconnect network; 4) Use of a relatively narrow bus consisting of 13 signal lines to keep the total area occupied by the bus small; 5) Use of segmented bus lines connected by programmable switches and programmable bus transceivers to facilitate easy isolation of bus defects; 6) use of special circuit for bus transceivers and asynchronous handshakes to facilitate dynamic bus configuration; 7) use of programmable control register to facilitate run-time bus reconfiguration; 8) Use of spare bus lines to provide local redundancy for the bus; 9) Use of spare rows and columns in the memory module to provide local redundancy, high defect tolerance in the hierarchical bus is obtained; and 10) use of sense amplifiers already associated with memory arrays as high speed (cache) memory.
Latched Sense Amplifiers As High Speed Memory In A Memory System
A memory system includes a plurality of memory modules, each including at least one memory array. Each memory array has an associated line of sense amplifier latches, wherein each line of sense amplifier latches is activated independently. Each line of sense amplifier latches is capable of caching a row of data from the associated memory array. The capacity of each memory array and the number of memory arrays are selected such that a cache hit rate of over 90 percent is achieved for the memory system.
Sheung Hee Park - Santa Clara CA Richard Fastow - Cupertino CA Wing Han Leung - Cupertino CA
Assignee:
Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:
G11C 1134
US Classification:
36518528, 36518522
Abstract:
In programming the threshold voltage of a memory cell transistor having a substrate, a gate insulator on the substrate, a floating gate on the gate insulator, an insulating layer on the floating gate, and a control gate on the insulating layer, and a source and drain in the substrate, a voltage difference is applied between the drain and source of the transistor and negative voltage is applied to the substrate of the transistor. An increasing voltage is applied to the control gate of the transistor, and, during application of that increasing voltage, a succession of verification tests are undertaken at a corresponding succession of times separated by chosen time intervals to verify if the transistor has been programmed to a chosen threshold voltage.
Memory Device Having Resistive Element Coupled To Reference Cell For Improved Reliability
Richard M. Fastow - Cupertino CA Wing Han Leung - Sunnyvale CA John Wang - San Jose CA
Assignee:
Advanced Micro Device, Inc. - Sunnyvale CA
International Classification:
G11C 702
US Classification:
365210, 3651852, 36518526, 36518529, 365226
Abstract:
A reference cell transistor with a series resistance to improve reliability in reading cells in an associated memory array. The reference cell transistor is coupled in series with a resistive element such that a reference current flows therethrough to reduce a voltage between a gate and a source of the reference cell transistor. This bends the I versus V curve of the reference cell downward and compensates for irregularities in the resistance seen in series with the memory cell transistors. In this fashion, the margin when reading memory cells is improved and the reference current is more reliable. The resistive element may be external to a region having the reference cell transistor. Alternatively, the resistive element may be internal to a region with the memory array and reference cell. For example, it may be formed by extending the source region of the reference cell transistor.
Sheung Hee Park - Pleasanton CA, US Wing Han Leung - Sunnyvale CA, US Richard M. Fastow - Cupertino CA, US
Assignee:
Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:
G11C016/04
US Classification:
36518518, 36518519, 36518533
Abstract:
A method of programming a memory device comprises applying a first programming voltage to one of a plurality of wordlines, corresponding to a cell to be programmed. The first programming voltage is substantially equal to the desired threshold voltage. A second programming voltage is also applied to one of a plurality of bitlines, corresponding to the cell to be programmed. The second programming voltage gradually increases from a low level toward a high level. The first programming voltage and second programming voltage are removed when the corresponding bitline current begins to decrease.
Method For Minimizing False Detection Of States In Flash Memory Devices
Richard Fastow - Cupertino CA, US Takao Akaogi - Cupertino CA, US Wing Leung - Palo Alto CA, US Zhigang Wang - Sunnyvale CA, US
Assignee:
Spansion LLC - Sunnyvale CA
International Classification:
G11C 16/06
US Classification:
36518522, 36518523, 36518502, 36518518
Abstract:
The present invention provides a method for determining program and erase states in flash memory devices. Specifically, one embodiment of the present invention discloses a method for minimizing false detection of states in an array of non-volatile floating gate memory cells. A plurality of word lines are arranged in a plurality of rows. A plurality of bit lines are arranged in a plurality of columns. The method begins by determining a selected bit line that is associated with a column of memory cells. Then, the method continues by biasing a group of word lines at a negative voltage. The group of word lines are electrically coupled to the associated memory cells. The application of negative voltage to the group of word lines limits leakage current contributions from the associated memory cells in the column of memory cells when performing a verify operation.
Gwyn Jones - Sunnyvale CA, US Wing Leung - Palo Alto CA, US Edward Franklin Runnion - Santa Clara CA, US Xuguang Wang - Sunnyvale CA, US Yi He - Fremont CA, US
Assignee:
Spansion LLC - Sunnyvale CA
International Classification:
G11C 16/06
US Classification:
36518522, 36518514, 36518533
Abstract:
A method of erasing a block of flash memory cells by applying a ramped gate erase voltage to the block of memory cells. When an erase verify of the block of memory cells indicates that erasure has not been successfully completed another erase voltage with a greater absolute value than the initial erase voltage can be applied to the block of memory cells until erasure is complete.