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Krishna Kumar Ganesan

age ~42

from Vancouver, WA

Also known as:
  • Krishna K Ganesan
  • Krishnakumar Ganesan
  • Krishna Kumar

Krishna Ganesan Phones & Addresses

  • Vancouver, WA
  • Hillsboro, OR
  • Portland, OR
  • Duluth, GA
  • Tucker, GA

Resumes

Krishna Ganesan Photo 1

Module & Integration Yield Engineer At Intel Corporation

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Location:
Portland, Oregon Area
Industry:
Semiconductors
Krishna Ganesan Photo 2

Software Engineering Manager

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Location:
Hillsboro, OR
Industry:
Computer Hardware
Work:
Intel Corporation
Software Engineering Manager

Intel Corporation Apr 2012 - Dec 2016
Bios Engineer

Ami: American Megatrends, Inc. Feb 2011 - Apr 2012
Software Engineer

American Megatrends India Pvt Ltd Aug 2010 - Feb 2011
Technologist

American Megatrends India Pvt Ltd Apr 2008 - Aug 2010
Senior System Software Engineer
Education:
Anna University 2001 - 2005
Bachelors, Bachelor of Technology
Prince Matriculation School 1999 - 2001
St.bede's Anglo Indian Higher Secondary School 1993 - 1999
Skills:
Bios
X86
X86 Assembly
Firmware
Device Drivers
C
Usb
Debugging
Software Engineering
Computer Architecture
Embedded Systems
Embedded Linux
Intel
Processors
Software Development
Languages:
Tamil
English
Krishna Ganesan Photo 3

Client Delivery Executive

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Work:

Client Delivery Executive
Krishna Ganesan Photo 4

Krishna Ganesan

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Krishna Ganesan Photo 5

Krishna Ganesan

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Us Patents

  • Chip Assemblies Employing Solder Bonds To Back-Side Lands Including An Electrolytic Nickel Layer

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  • US Patent:
    20190237391, Aug 1, 2019
  • Filed:
    Oct 27, 2016
  • Appl. No.:
    16/329170
  • Inventors:
    - Santa Clara CA, US
    Krishna Prakash GANESAN - Portland OR, US
    Ashish BHATIA - Portland OR, US
    Vinay SRIRAM - Aloha OR, US
    John MUIRHEAD - Portland OR, US
    Hiten KOTHARI - Beaverton OR, US
    Aloysius A. GUNAWAN - Portland OR, US
    Lavanya ARYASOMAYAJULA - Hillsboro OR, US
    Shravan GOWRISHANKAR - Beaverton OR, US
    Sriram PATTABHIRAMAN - Hillsboro OR, US
    Sudipto GUHA - Hillsboro OR, US
  • Assignee:
    Intel Corporation - Santa Clara CA
  • International Classification:
    H01L 23/48
    H01L 21/768
    H01L 25/18
    H01L 23/00
    H01L 23/522
    H01L 23/528
    H01L 21/822
  • Abstract:
    A stacked-chip assembly including a plurality of IC chips or die that are stacked, and electrically coupled by solder bonds. In accordance with some embodiments described further below, the solder bonds are to contact a back-side land that includes a diffusion barrier to reduce intermetallic formation and/or other solder-induced reliability issues. The back-side land may include an electrolytic nickel (Ni) barrier layer separating solder from a back-side redistribution layer trace. This electrolytic Ni may be of high purity, which at least in part, may enable the backside metallization stack to be of minimal thickness while still functioning as a diffusion barrier. In some embodiments, the back-side land composition and architecture is distinct from a front-side land composition and/or architecture.
  • Techniques For Monitoring Errors And System Performance Using Debug Trace Information

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  • US Patent:
    20190042391, Feb 7, 2019
  • Filed:
    Dec 28, 2017
  • Appl. No.:
    15/856427
  • Inventors:
    - SANTA CLARA CA, US
    Krishna Kumar Ganesan - Hillsboro OR, US
    Rolf Kuehnis - Portland OR, US
    Eija Maarit Hillevi Manninen - Hillsboro OR, US
  • Assignee:
    INTEL CORPORATION - SANTA CLARA CA
  • International Classification:
    G06F 11/36
    G06F 11/34
    G06F 11/30
  • Abstract:
    Techniques and apparatus for error and performance analysis of a computing device are described. In one embodiment, for example, an apparatus may include at least one memory and logic coupled to the at least one memory, wherein the logic is further to access at least one trace associated with at least one trace source, access timing information associated with the at least one trace, generate a plurality of waypoints for at least one trace, each of the plurality of waypoints comprising a step of at least one trace and a time stamp, and generate at least one performance benchmark log for the at least one trace, the at least one benchmark log comprising a plurality of benchmark waypoints corresponding to the plurality of waypoints.
  • Automated Secure Data And Firmware Migration Between Removable Storage Devices That Supports Boot Partitions And Replay Protected Memory Blocks

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  • US Patent:
    20180253238, Sep 6, 2018
  • Filed:
    Mar 2, 2017
  • Appl. No.:
    15/448380
  • Inventors:
    - Santa Clara CA, US
    Krishna Kumar Ganesan - Hillsboro OR, US
    Vincent J. Zimmer - Federal Way WA, US
  • Assignee:
    Intel Corporation - Santa Clara CA
  • International Classification:
    G06F 3/06
    G06F 9/44
    G06F 21/57
    G06F 12/14
    H04L 9/32
  • Abstract:
    Systems, apparatuses and methods may include technology that detects a migration request and conducts a first transfer, via a trusted execution environment (TEE), of storage context information from a first removable storage device to a secure memory region of a system in response to the data migration request. Additionally, the technology may conduct a second transfer, via the TEE, of the storage context information from the secure memory region to a second removable storage device, wherein the storage context information includes factory data, security data and boot firmware.
  • Communication Devices Having An Energy Management Interface

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  • US Patent:
    20170181105, Jun 22, 2017
  • Filed:
    Dec 16, 2015
  • Appl. No.:
    14/970577
  • Inventors:
    - Santa Clara CA, US
    Krishna Kumar GANESAN - Hillsboro OR, US
    Yasuharu OMI - Hillsboro OR, US
  • International Classification:
    H04W 52/28
    H04W 52/02
  • Abstract:
    A communication device is provided. The communication device may include at least one wireless communication circuit, an energy management interface coupled to the at least one wireless communication circuit, an operating system executed on the communication device, and a human proximity determination circuit configured to generate a human proximity signal upon detecting proximity of a human body part and to send the human proximity signal to the operating system. The energy management interface is configured to receive the human proximity signal from the operating system, and to notify the at least one wireless communication circuit based on the received human proximity signal.
  • Technologies For Managing Power Of An Embedded Controller During A Low-Power State

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  • US Patent:
    20160282929, Sep 29, 2016
  • Filed:
    Mar 27, 2015
  • Appl. No.:
    14/671721
  • Inventors:
    Pronay Dutta - Beaverton OR, US
    Krishna Kumar Ganesan - Hillsboro OR, US
  • International Classification:
    G06F 1/32
    G06F 9/44
  • Abstract:
    Technologies for managing the power usage of components of a computing device, while the components and the computing device are in a low-power state, such as a connected standby state. An embedded controller includes a wake-up timer designed to wake up the embedded controller during a low-power state to allow the embedded controller to perform its tasks. A power control system is configured to dynamically alter the timing cycle of the wake-up timer of the embodied controller based on operation data received. The dynamically altered timing cycle is designed to conserve power, but maintain functionality of the embedded controller.
  • Technologies For Providing Hardware Subscription Models Using Pre-Boot Update Mechanism

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  • US Patent:
    20160188868, Jun 30, 2016
  • Filed:
    Dec 27, 2014
  • Appl. No.:
    14/583656
  • Inventors:
    Sudhakar Otturu - Portland OR, US
    Krishna Kumar Ganesan - Hillsboro OR, US
    Erik Holt - Sammamish WA, US
  • International Classification:
    G06F 21/44
    G06F 9/445
    H04L 12/24
  • Abstract:
    Technologies to enable, disable and control hardware subscription features. Computing devices communicate over a network to a subscription server to provide hardware platform information for each of the computing devices. As the subscription server receives hardware platform information, the subscription server determines the hardware features that are enabled, and further determines what hardware subscription options are available for each of the computing devices. When a hardware subscription option is selected/purchased by a computing device, subscription server provides a pre-boot update mechanism, such as a Unified Extensible Firmware Interface (UEFI) capsule, to act as a boot level program that enables hardware features on the computing device. Hardware subscription features are also securely protected using cryptographic engine modules.
  • Selectively Enabling Platform-Specific Features

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  • US Patent:
    20150268970, Sep 24, 2015
  • Filed:
    Mar 21, 2014
  • Appl. No.:
    14/221983
  • Inventors:
    Giri P. Mudusuru - Portland OR, US
    Krishna Kumar Ganesan - Hillsboro OR, US
    Nicholas J. Adams - Beaverton OR, US
    Sandeep R. Nair - Hillsboro OR, US
  • International Classification:
    G06F 9/44
  • Abstract:
    Technologies for selectively enabling platform-specific features includes a computing device that initializes virtual device driver logic to interface with a virtual device of an Advanced Configuration and Power Interface (ACPI) subsystem. The ACPI subsystem includes an operating system (OS)-specific function specification associated with the virtual device. The OS-specific function specification includes OS-specific functions to be performed by the ACPI subsystem based on an identified OS. The virtual device driver logic transmits a call to the OS-specific function specification in the ACPI subsystem. The call includes an identifier of an OS of the computing device that uniquely identifies the OS from other operating systems. The ACPI subsystem analyzes the OS-specific function specification to determine OS-specific functions associated with the OS based on the identifier. The ACPI subsystem performs the determined OS-specific functions.

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Krishna Ganesan Photo 6

Hari Krishna Ganesan

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Krishna Ganesan Photo 7

Siva Rama Krishna Ganesan

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Krishna Ganesan Photo 8

Krishna Ganesan

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Krishna Ganesan Photo 9

Krishna Ganesan

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Krishna Ganesan Photo 10

Krishna Ganesan

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Krishna Ganesan Photo 11

Krishna Ganesan

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Krishna Ganesan Photo 12

Krishna Prakash Ganesan

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Krishna Ganesan Photo 13

Krishna Kumar Ganesan

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Myspace

Krishna Ganesan Photo 14

Krishna Ganesan

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Locality:
DTROIT
Gender:
Male
Birthday:
1949

Googleplus

Krishna Ganesan Photo 15

Krishna Ganesan

Youtube

Holi Ki Masti | Chotu Ganesha, Baal Hanuman A...

This collection features the new set of popular nursery rhymes and kid...

  • Duration:
    12m 19s

Viswanatha Nayakudu Full Movie || Krishnam Ra...

Viswanatha Nayakudu is a 1987 Telugu movie Starring Krishnam Raju, Kri...

  • Duration:
    2h 34m 8s

interesting facts about Superstar Krishna and...

Superstarkrishna #Sivajiganesan #cinemasitraalu interesting facts abou...

  • Duration:
    4m 7s

ENGAGEMENT HIGHLIGHTS KRISHNA KUMAR + AISHWAR...

ENGAGEMENT HIGHLIGHTS KRISHNA KUMAR + AISHWARYA GANESAN.

  • Duration:
    4m 33s

: Krishna Janmashtami Songs (HD) Meena Kumari...

Vrindavan Ka Krishna Kanhaiya is a song from the 1957 movie Miss Mary ...

  • Duration:
    3m 19s

#Mahanati Deleted Scene 3 | Gemini Ganesan an...

Here is #Mahanati Deleted Scene 3 | Gemini Ganesan and Rekha Scene The...

  • Duration:
    3m 17s

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