Raymond J Wolter

US Patent:

6965499, Nov 15, 2005

Filed:

Apr 23, 2003

Appl. No.:

10/421180

Inventors:

Yiduo Zhang - Plymouth MN, US
Raymond R. Wolter - Hutchinson MN, US
Craig A. Leabch - Saint Cloud MN, US

Assignee:

Hutchinson Technology Incorporated - Hutchinson MN

International Classification:

G11B005/48

US Classification:

3602348, 3602458

Abstract:

A head suspension or head suspension component article configured for solder ball bonding of a head slider to electrical traces on article. The article including electrical traces formed from electrically conductive material with the electrical traces having a bonding region adapted for electrical bonding to a head slider. Also included is a support structure providing support for at least portions of the electrical traces and including a head slider mounting region adapted to receive the head slider. This structure is configured to mechanically and thermally isolate the bonding region of the electrical traces from the head slider mounting region to reduce mechanical and thermal effects of a solder ball bonding process on the article during solder ball bonding of the head slider to the electrical traces. The support structure may be reduced at or around the bonding region, or the conductive material may be increased to dissipate more heat.

US Patent:

7339767, Mar 4, 2008

Filed:

Sep 16, 2004

Appl. No.:

10/942389

Inventors:

Yiduo Zhang - Plymouth MN, US
Raymond R. Wolter - Hutchinson MN, US

Assignee:

Hutchinson Technology Incorporated - Hutchinson MN

International Classification:

G11B 5/48

US Classification:

3602446, 3602444, 3602445

Abstract:

A baseplate for swaging a head suspension to an actuator arm includes a flange with an opening having a back bore diameter and a boss tower extending from the flange and having an outer diameter. The back bore diameter is less than or equal to about 105% of the outer diameter and greater than or equal to about 90% of the outer diameter.